S.-U. Zhang
“Classifying Thermal Degradation of Polyactic Acid by Using Machine Learning Algorithms
Trained on Fourier Transform Infrared Spectroscopy Data”
>Department of Automotive Engineering, Dong-Eui University,
Busan 47340, Korea , 2020-10-21 | journal-article.
DOI:
10.3390/app10217470
Hyun-Joo Yoo, S.-U. Zhang , Sun-Jin Jung
“Big Data Analysis on Oyster Growth and FLUPSY Environment”
>Journal of the Korean Society of Manufacturing Process
Engineers Vol. 19, No. 7, July, 2020 , 2020-03-22 | journal-article.
DOI:
10.14775/ksmpe.2020.19.07.106
Na-Yeon Choi, Byoung-Chul Shin, S.-U. Zhang
“A Comparative Study of the Linear-elastic and Hyperelastic Models
for Degradation of PLA Prepared using Fused Filament Fabrication”
>Journal of the Korean Society of Manufacturing Process
Engineers , 2020-03-22 | journal-article.
...
S.-U. Zhang
"Classifying Degraded Three-Dimensionally Printed Polylactic Acid
Specimens Using Artificial Neural Networks based on Fourier
Transform Infrared Spectroscopy"
Applide Sciences , 2019 | journal-article
DOI:
10.3390/app9132772
K.-S. Seol, P. Zhao, B.-C. Shin, S.-U. Zhang
“Infill Print Parameters for Mechanical Properties of 3D Printed
PLA Parts”
Journal of the Korean Society of Manufacturing Process
Engineers , 2018-08-01 | journal-article.
https://doi.org/10.14775/ksmpe.2018.17.4.009
S.-U. Zhang
“Degradation Classification of 3D Printing Thermoplastics Using
Fourier Transform Infrared Spectroscopy and Artificial Neural
Networks”
Applied Sciences , 2018-07-25 | journal-article.
DOI:
10.3390/app8081224
K.-S. Seol, B.-C. Shin, S.-U. Zhang
“Fatigue Test of 3D-printed ABS Parts Fabricated by Fused
Deposition Modeling”
Journal of the Korean Society of Manufacturing Process
Engineers , 2018 | journal-article.
https://doi.org/10.14775/ksmpe.2018.17.3.093
S.-U. Zhang
“Numerical evaluation of ABS parts fabricated by fused deposition
modeling and vapor smoothing”
Advances in Science, Technology and Engineering Systems
Journal , 2017-12-01| journal-article.
DOI:10.25046/aj020620
S.-U. Zhang
“Long-Term Reliability Prediction of LED Packages Using Numerical
Simulation”
Solid State Lighting Reliability Part 2 , 2017-07-13|
book-chapter.
https://doi.org/10.1007/978-3-319-58175-0_18
S.J. Noh, N.H. Myung, M.J. Park, S.G. Kim,
S.-U. Zhang , H.-W. Kang
“3D bioprinting for tissue engineering”
Clinical Regenerative Medicine in Urology , 2017 |
book-chapter.
DOI:
10.1007/978-981-10-2723-9_5
S.-U. Zhang , J.H. Han, H.-W. Kang
“Temperature-dependent mechanical properties of ABS parts
fabricated by fused deposition modeling and vapor smoothing”
International Journal of Precision Engineering and
Manufacturing , 2017 | journal-article.
DOI:
10.1007/s12541-017-0091-7
S.-U. Zhang
“Chip package interaction for LED packages”
Reliability , 2016-08 | journal-article.
DOI:
10.1016/j.microrel.2016.06.014
S.-U. Zhang
“Quantification of silicone degradation for LED packages using
finite element analysis”
Microelectronics Reliability , 2015-12 |
journal-article.
DOI:
10.1016/j.microrel.2015.09.006
S.-U. Zhang , B.W. Lee
“Fatigue life evaluation of wire bonds in LED packages using
numerical analysis”
Microelectronics Reliability , 2014 | journal-article.
DOI:
10.1016/j.microrel.2014.07.142
S.-U. Zhang , A.V. Kumar
“Inverse method for estimating resistivity of carbon fiber
composite structures”
Journal of Engineering Materials and Technology, Transactions
of the ASME , 2011 | journal-article.
DOI:
10.1115/1.4002627
S.-U. Zhang , A.V. Kumar
“Three-dimensional magnetostatic analysis using structured mesh
and nodal elements”
IEEE Transactions on Magnetics , 2011 |
journal-article.
DOI:10.1109/TMAG.2010.2086064
R.J. Sadleir, S.-U. Zhang , A.S. Tucker, S.H. Oh
“Imaging and quantification of anomaly volume using an
eight-electrode 'hemiarray' EIT reconstruction method”
Physiological Measurement , 2008 | journal-article.
DOI:
10.1088/0967-3334/29/8/005
R.J. Sadleir, S. Grant, S.-U. Zhang , S.H. Oh,
B.I. Lee, E.J. Woo,
“High field MREIT: Setup and tissue phantom imaging at 11 T”
Physiological Measurement , 2006 | journal-article.
DOI:
10.1088/0967-3334/27/5/S22
R.J. Sadleir, S. Grant, S.-U. Zhang , B.I. Lee,
H.C. Pyo, S.H. Oh, C. Park, E.J. Woo, S.Y. Lee, O. Kwon,J.K. Seo,
“Noise analysis in magnetic resonance electrical impedance
tomography at 3 and 11 T field”
Physiological Measurement , 2005 | journal-article.
DOI:
10.1088/0967-3334/26/5/023
Source:Sung-Uk Zhang viaScopus - Elsevier
“Mechanical and Multi-Physics Simulation and Experiments in
Microelectronics and Microsystems - Wire bonding lifetime
prediction of LED packages using numerical analysis”
2017 18th International Conference on Thermal, EuroSimE
2017 , 2017 | conference-paper.
DOI: 10.1109/EuroSimE.2017.7926222
EID: 2-s2.0-85020170391
Sung-Uk Zhang , Jonghyeuk Han, Hyun-Wook Kang,
Byoung-Chul Shin
"Keynote presentation – Thermo-mechanical properties of 3D printed
ABS parts fabricated by fused deposition modelling and vapor
smoothing"
Ulsan National Institute of Science of Technology, Ulsan, South
Korea , 2017-04-04
DOI:
https://www.eurosime.org/index.php/2017-dresden/
Corresponding Author: Sung-Uk Zhang – Samsung
Electronics
“Thermo-mechanical properties of ABS parts fabricated by fused
deposition modeling and vapor smoothing”
... , 2013-04-17
DOI:
https://www.eurosime.org/index.php/2013-wroclaw/
Source:Scopus - Elsevier
“Analysis of magnetically actuated structures using implicit
boundary finite element method”
Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC
Structures, Structural Dynamics and Materials Conference , 2010 | conference-paper.
EID: 2-s2.0-84855627458
Source:Scopus - Elsevier
“Damage sensing by inverse estimation of electrical resistivity of
composite structure”
Proceedings of the ASME Design Engineering Technical
Conference , 2010 | conference-paper.
DOI: 10.1115/DETC2010-28859
EID: 2-s2.0-80054966946
S.-U. Zhang
“Portable 8-electrode EIT measurement system”
IFMBE Proceedings , 2010 | conference-paper.
DOI: 10.1115/DETC2010-28859
Source:Scopus - Elsevier
“Portable 8-electrode EIT measurement system”
IFMBE Proceedings , 2007 | conference-paper.
EID: 2-s2.0-84876499784
Source:Scopus - Elsevier
“Noise analysis of MREIT at 3T and 11T field strength”
Annual International Conference of the IEEE Engineering in
Medicine and Biology - Proceedings , 2005 | conference-paper.
EID: 2-s2.0-33846936035
과제명
ICT DNA를 기반으로한 개체굴 양식어장 관리시스템 개발
연구내용
빅데이터 수집, 클라우드 저장, AI 분석을 통한 양식 최적화 및 생산량
예측 시스템
연구지원기관
과학기술정보통신부
과제명
고분자 열화에 따른 3D프린터 제품의 신뢰성 평가
연구내용
AI를 활용한 평가 모델, 열화 현상에 따른 물성 평가, CAE를 이용한
디자인 가이드 구축
연구지원기관
한국연구재단
과제명
고저압 자동연동에 의한 휴대용 초고압 핸드 유압펌프 개발
연구내용
CAE를 이용한 제품의 수명 예측 모델 개발, 오일링의 열화에 따른
디자인 가이드 구축
연구지원기관
산업자원부
과제명
LED 신뢰성 예측 모델 개발
연구내용
CAE를 이용한 제품의 LED 신뢰성 모델 개발, 구조해석 지원
연구지원기관
삼성전자